CRYSCORE polishes the sapphire wafers by special CMP (Chemical Mechanical Polishing) technology, which is a widely used planarization technology, and provides the customers with high surface quality sapphire wafers at low cost.
We carry a variety of standard sapphire wafers and sapphire substrates in stock to ensure a quick delivery. The wafers are cleaned in class 100 cleanroom by ultrapure water with quality above 18 MΩ *cm, and then packed in clean cassettes. 25 pcs a pack or single pack is available to maximize customer flexibility in their research.
|Item||2-inch C-plane(0001) 430μm Sapphire Wafers|
|Crystal Materials||99,999%, High Purity, Monocrystalline Al2O3|
|C-plane off-angle toward M-axis 0.2 +/- 0.1°|
|Diameter||50.8 mm +/- 0.1 mm|
|Thickness||430 μm +/- 25 μm|
|Primary Flat Orientation||A-plane(11-20) +/- 0.2°|
|Primary Flat Length||16.0 mm +/- 1.0 mm|
|Single Side Polished||Front Surface||Epi-polished, Ra < 0.2 nm (by AFM)|
|(SSP)||Back Surface||Fine ground, Ra = 0.8 μm to 1.2 μm|
|Double Side Polished||Front Surface||Epi-polished, Ra < 0.2 nm (by AFM)|
|(DSP)||Back Surface||Epi-polished, Ra < 0.2 nm (by AFM)|
|TTV||< 10 μm|
|BOW||< 10 μm|
|WARP||< 10 μm|
|Cleaning / Packaging||Class 100 cleanroom cleaning and vacuum packaging,|
|25 pieces in one cassette packaging or single piece packaging.|
Note: Custom sapphire wafers with any orientation and any thickness can be provided.